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| Manufacturer | NXP Semiconductors |
|---|---|
| Manufacturer's Part Number | NT2H0301F0DTP |
| Description | MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 4; Package Code: HVSON; Package Shape: RECTANGULAR; |
| Datasheet | NT2H0301F0DTP Datasheet |
| In Stock | 4,142 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Maximum Seated Height: | .5 mm |
| Sub-Category: | Serial IO/Communication Controllers |
| Surface Mount: | YES |
| Terminal Finish: | NICKEL PALLADIUM GOLD SILVER |
| No. of Terminals: | 4 |
| Terminal Position: | DUAL |
| Package Style (Meter): | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
| Technology: | CMOS |
| JESD-30 Code: | R-PDSO-N4 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | NO LEAD |
| Maximum Operating Temperature: | 70 Cel |
| Package Code: | HVSON |
| Width: | 1.5 mm |
| Moisture Sensitivity Level (MSL): | 1 |
| Peripheral IC Type: | MICROPROCESSOR CIRCUIT |
| JESD-609 Code: | e4 |
| Minimum Operating Temperature: | -25 Cel |
| Qualification: | Not Qualified |
| Package Equivalence Code: | SOLCC8,.12,20 |
| Length: | 2 mm |
| Peak Reflow Temperature (C): | 260 |
| Terminal Pitch: | .5 mm |
| Temperature Grade: | OTHER |
