NXP Semiconductors - NT2H1311F0DTL

NT2H1311F0DTL by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number NT2H1311F0DTL
Description TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 4; Package Code: HVSON; Package Shape: RECTANGULAR;
Datasheet NT2H1311F0DTL Datasheet
In Stock883
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Telecom IC Type: TELECOM CIRCUIT
Maximum Seated Height: .5 mm
Surface Mount: YES
Minimum Operating Temperature: -25 Cel
No. of Functions: 1
No. of Terminals: 4
Terminal Position: DUAL
Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Length: 2 mm
JESD-30 Code: R-PDSO-N4
Package Shape: RECTANGULAR
Terminal Form: NO LEAD
Maximum Operating Temperature: 70 Cel
Package Code: HVSON
Width: 1.5 mm
Terminal Pitch: .5 mm
Temperature Grade: OTHER
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