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| Manufacturer | NXP Semiconductors |
|---|---|
| Manufacturer's Part Number | NX3DV2567HR,115 |
| Description | Multiplexers or Switches; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: HVBCC; Package Shape: SQUARE; Surface Mount: YES; |
| Datasheet | NX3DV2567HR,115 Datasheet |
| In Stock | 1,688 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Width (mm): | 3 mm |
| Maximum Seated Height: | .5 mm |
| Minimum Supply Voltage (Vsup): | 1.4 V |
| Maximum Switch-on Time: | 120 ns |
| Sub-Category: | Multiplexer or Switches |
| Nominal On-state Resistance Match: | .1 ohm |
| Surface Mount: | YES |
| Terminal Finish: | MATTE TIN |
| No. of Terminals: | 16 |
| Maximum On-state Resistance (Ron): | .85 ohm |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| Technology: | CMOS |
| JESD-30 Code: | S-PBCC-B16 |
| Package Shape: | SQUARE |
| Terminal Form: | BUTT |
| Maximum Operating Temperature: | 125 Cel |
| No. of Channels: | 4 |
| Package Code: | HVBCC |
| Switching (V): | BREAK-BEFORE-MAKE |
| Nominal Supply Voltage (Vsup): | 1.5 V |
| Moisture Sensitivity Level (MSL): | 1 |
| Nominal Off-state Isolation: | 60 dB |
| Maximum Switch-off Time: | 90 ns |
| JESD-609 Code: | e3 |
| Minimum Operating Temperature: | -40 Cel |
| No. of Functions: | 1 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | LCC16,.12SQ,20 |
| Length: | 3 mm |
| Output (V): | SEPARATE OUTPUT |
| Additional Features: | DATA PATH SWITCH: RON RESISTANCE IS 11 OHMS;ON-STATE RESISTANCE MATCH-0.2OHM |
| Peak Reflow Temperature (C): | 260 |
| Terminal Pitch: | .5 mm |
| Temperature Grade: | AUTOMOTIVE |
| Maximum Supply Voltage (Vsup): | 4.3 V |
| Power Supplies (V): | 1.4/4.3 |
