NX3DV2567HR-Q100 by NXP Semiconductors | Other Function Semiconductors

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Manufacturer	NXP Semiconductors
Manufacturer's Part Number	NX3DV2567HR-Q100
Description	4PDT; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: HVBCC; Package Shape: SQUARE; Surface Mount: YES;
Datasheet	NX3DV2567HR-Q100 Datasheet
In Stock	3,143

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Width (mm):	3 mm
Maximum Seated Height:	.5 mm
Minimum Supply Voltage (Vsup):	1.4 V
Maximum Switch-on Time:	120 ns
Nominal On-state Resistance Match:	.1 ohm
Surface Mount:	YES
No. of Terminals:	16
Maximum On-state Resistance (Ron):	.85 ohm
Terminal Position:	BOTTOM
Package Style (Meter):	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Screening Level:	AEC-Q100
Technology:	CMOS
JESD-30 Code:	S-PBCC-B16
Package Shape:	SQUARE
Terminal Form:	BUTT
Maximum Operating Temperature:	125 Cel
No. of Channels:	4
Package Code:	HVBCC
Nominal Supply Voltage (Vsup):	1.5 V
Nominal Off-state Isolation:	60 dB
Maximum Switch-off Time:	90 ns
Minimum Operating Temperature:	-40 Cel
No. of Functions:	1
Other IC type:	4PDT
Length:	3 mm
Additional Features:	DATA PATH SWITCH: RON RESISTANCE IS 11 OHMS;ON-STATE RESISTANCE MATCH-0.2OHM
Terminal Pitch:	.5 mm
Temperature Grade:	AUTOMOTIVE
Maximum Supply Voltage (Vsup):	4.3 V

Pricing (USD)

Qty.	Unit Price	Ext. Price
3,143	-	-

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