NXP Semiconductors - NX3DV642GU,115

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NX3DV642GU,115 by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number NX3DV642GU,115
Description 3PDT; Temperature Grade: INDUSTRIAL; No. of Terminals: 24; Package Code: QCCN; Package Shape: RECTANGULAR; Surface Mount: YES;
Datasheet NX3DV642GU,115 Datasheet
In Stock20,889
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Time At Peak Reflow Temperature (s): 30
Sub-Category: Multiplexer or Switches
Surface Mount: YES
No. of Terminals: 24
Maximum On-state Resistance (Ron): 14 ohm
Terminal Position: QUAD
Package Style (Meter): CHIP CARRIER
JESD-30 Code: R-PQCC-N24
Package Shape: RECTANGULAR
Terminal Form: NO LEAD
Maximum Operating Temperature: 85 Cel
Package Code: QCCN
Switching (V): BREAK-BEFORE-MAKE
Moisture Sensitivity Level (MSL): 1
Other Names: 568-12389-1
568-12389-2
568-12389
568-12389-6
NXPNXPNX3DV642GU,115
NX3DV642GU,115-ND
2156-NX3DV642GU,115
935296521115
Minimum Operating Temperature: -40 Cel
No. of Functions: 2
Qualification: Not Qualified
Package Equivalence Code: LCC24,.1X.14,16
Other IC type: 3PDT
Output (V): SEPARATE OUTPUT
Peak Reflow Temperature (C): 260
Terminal Pitch: .4 mm
Temperature Grade: INDUSTRIAL
Power Supplies (V): 3/4
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