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| Manufacturer | NXP Semiconductors |
|---|---|
| Manufacturer's Part Number | NX3L1G66GW-Q100H |
| Description | SPST; Temperature Grade: AUTOMOTIVE; No. of Terminals: 5; Package Code: TSSOP; Package Shape: RECTANGULAR; Surface Mount: YES; |
| Datasheet | NX3L1G66GW-Q100H Datasheet |
| In Stock | 230 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Maximum Switch-on Time: | 41 ns |
| Sub-Category: | Multiplexer or Switches |
| Surface Mount: | YES |
| No. of Terminals: | 5 |
| Maximum On-state Resistance (Ron): | 4.1 ohm |
| Terminal Position: | DUAL |
| Package Style (Meter): | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| Screening Level: | AEC-Q100 |
| Technology: | CMOS |
| JESD-30 Code: | R-PDSO-G5 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | GULL WING |
| Maximum Operating Temperature: | 125 Cel |
| Package Code: | TSSOP |
| Switching (V): | BREAK-BEFORE-MAKE |
| Moisture Sensitivity Level (MSL): | 1 |
| Normal Position (V): | NO |
| Minimum Operating Temperature: | -40 Cel |
| No. of Functions: | 1 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | TSSOP5/6,.08 |
| Other IC type: | SPST |
| Peak Reflow Temperature (C): | 260 |
| Terminal Pitch: | .635 mm |
| Temperature Grade: | AUTOMOTIVE |
| Power Supplies (V): | 1.4/4.3 |
