NXP Semiconductors - NX3L1T66GW

NX3L1T66GW by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number NX3L1T66GW
Description SPST; Temperature Grade: AUTOMOTIVE; No. of Terminals: 5; Package Code: TSSOP; Package Shape: RECTANGULAR; Surface Mount: YES;
Datasheet NX3L1T66GW Datasheet
In Stock1,616
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Width (mm): 1.25 mm
Maximum Seated Height: 1.1 mm
Minimum Supply Voltage (Vsup): 1.4 V
Maximum Switch-on Time: 57 ns
Surface Mount: YES
Terminal Finish: TIN
No. of Terminals: 5
Maximum On-state Resistance (Ron): 1.7 ohm
Terminal Position: DUAL
Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Technology: CMOS
JESD-30 Code: R-PDSO-G5
Package Shape: RECTANGULAR
Terminal Form: GULL WING
Maximum Operating Temperature: 125 Cel
No. of Channels: 1
Package Code: TSSOP
Nominal Supply Voltage (Vsup): 1.65 V
Moisture Sensitivity Level (MSL): 1
Nominal Off-state Isolation: 90 dB
Maximum Switch-off Time: 90 ns
JESD-609 Code: e3
Minimum Operating Temperature: -40 Cel
No. of Functions: 1
Qualification: Not Qualified
Other IC type: SPST
Length: 2.05 mm
Terminal Pitch: .65 mm
Temperature Grade: AUTOMOTIVE
Maximum Supply Voltage (Vsup): 4.3 V
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Pricing (USD)

Qty. Unit Price Ext. Price
1,616 - -

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