NXP Semiconductors - NX3L4357GM,115

NX3L4357GM,115 by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number NX3L4357GM,115
Description SP3T; Temperature Grade: AUTOMOTIVE; No. of Terminals: 10; Package Code: QCCN; Package Shape: RECTANGULAR; Surface Mount: YES;
Datasheet NX3L4357GM,115 Datasheet
In Stock9,661
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Time At Peak Reflow Temperature (s): 30
Sub-Category: Multiplexer or Switches
Surface Mount: YES
No. of Terminals: 10
Maximum On-state Resistance (Ron): 4.1 ohm
Terminal Position: QUAD
Package Style (Meter): CHIP CARRIER
Technology: CMOS
JESD-30 Code: R-PQCC-N10
Package Shape: RECTANGULAR
Terminal Form: NO LEAD
Maximum Operating Temperature: 125 Cel
Package Code: QCCN
Switching (V): BREAK-BEFORE-MAKE
Moisture Sensitivity Level (MSL): 1
Minimum Operating Temperature: -40 Cel
No. of Functions: 1
Qualification: Not Qualified
Package Equivalence Code: LCC10,.06X.08,20
Other IC type: SP3T
Peak Reflow Temperature (C): 260
Terminal Pitch: .5 mm
Temperature Grade: AUTOMOTIVE
Power Supplies (V): 1.4/4.3
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Pricing (USD)

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