NX5P2925CUKZ by NXP Semiconductors | Other Function Semiconductors

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Manufacturer	NXP Semiconductors
Manufacturer's Part Number	NX5P2925CUKZ
Description	Power Management Circuits; Temperature Grade: INDUSTRIAL; No. of Terminals: 6; Package Code: FBGA; Package Shape: RECTANGULAR; Surface Mount: YES;
Datasheet	NX5P2925CUKZ Datasheet
In Stock	657

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Maximum Supply Current (Isup):	.15 mA
Sub-Category:	Power Management Circuits
Surface Mount:	YES
Minimum Operating Temperature:	-40 Cel
No. of Terminals:	6
Qualification:	Not Qualified
Package Equivalence Code:	BGA6,2X3,20
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY, FINE PITCH
JESD-30 Code:	R-PBGA-B6
Package Shape:	RECTANGULAR
Terminal Form:	BALL
Maximum Operating Temperature:	85 Cel
Peak Reflow Temperature (C):	260
Package Code:	FBGA
Terminal Pitch:	.5 mm
Temperature Grade:	INDUSTRIAL
Power Supplies (V):	1.2/5
Moisture Sensitivity Level (MSL):	1

Pricing (USD)

Qty.	Unit Price	Ext. Price
657	-	-

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