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Manufacturer | NXP Semiconductors |
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Manufacturer's Part Number | P2020NXN2HFC |
Description | MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE; Terminal Position: BOTTOM; |
Datasheet | P2020NXN2HFC Datasheet |
In Stock | 3,506 |
NAME | DESCRIPTION |
---|---|
Minimum Supply Voltage: | 1 V |
Package Body Material: | PLASTIC/EPOXY |
Nominal Supply Voltage: | 1.05 V |
Integrated Cache: | YES |
Maximum Time At Peak Reflow Temperature (s): | 40 |
Maximum Seated Height: | 2.46 mm |
Sub-Category: | Microprocessors |
Surface Mount: | YES |
Terminal Finish: | TIN SILVER |
No. of Terminals: | 689 |
Terminal Position: | BOTTOM |
Format: | FIXED POINT |
Package Style (Meter): | GRID ARRAY |
No. of DMA Channels: | 4 |
Address Bus Width: | 16 |
Technology: | CMOS |
JESD-30 Code: | S-PBGA-B689 |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Package Code: | BGA |
Width: | 31 mm |
Moisture Sensitivity Level (MSL): | 3 |
Speed: | 800 rpm |
Peripheral IC Type: | MICROPROCESSOR, RISC |
Maximum Supply Voltage: | 1.1 V |
No. of External Interrupts: | 7 |
Low Power Mode: | NO |
Boundary Scan: | YES |
External Data Bus Width: | 64 |
JESD-609 Code: | e2 |
Qualification: | Not Qualified |
Package Equivalence Code: | BGA689,29X29,40 |
Length: | 31 mm |
Peak Reflow Temperature (C): | 260 |
Terminal Pitch: | 1 mm |
Power Supplies (V): | 1.05 |