NXP Semiconductors - P89LPC9151FDH,129

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P89LPC9151FDH,129 by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number P89LPC9151FDH,129
Description Microcontrollers; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: TSSOP; Package Shape: RECTANGULAR;
Datasheet P89LPC9151FDH,129 Datasheet
In Stock1,695
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Sub-Category: Microcontrollers
Surface Mount: YES
Maximum Supply Current: 23 mA
Terminal Finish: MATTE TIN
No. of Terminals: 14
Terminal Position: DUAL
Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Technology: CMOS
JESD-30 Code: R-PDSO-G14
Package Shape: RECTANGULAR
ROM Words: 2048
Terminal Form: GULL WING
Maximum Operating Temperature: 85 Cel
Package Code: TSSOP
Moisture Sensitivity Level (MSL): 1
Speed: 18 rpm
RAM Bytes: 256
Bit Size: 8
JESD-609 Code: e3
Minimum Operating Temperature: -40 Cel
Qualification: Not Qualified
Package Equivalence Code: TSSOP14,.25
ROM Programmability: FLASH
Terminal Pitch: .635 mm
Temperature Grade: INDUSTRIAL
Power Supplies (V): 2.5/3.3
CPU Family: 8051
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