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Manufacturer | NXP Semiconductors |
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Manufacturer's Part Number | P89LPC915FN,112 |
Description | Microcontrollers; Temperature Grade: INDUSTRIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 14; Package Code: DIP; Package Shape: RECTANGULAR; |
Datasheet | P89LPC915FN,112 Datasheet |
In Stock | 4,634 |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Sub-Category: | Microcontrollers |
Surface Mount: | NO |
Maximum Supply Current: | 16 mA |
Terminal Finish: | MATTE TIN |
No. of Terminals: | 14 |
Terminal Position: | DUAL |
Package Style (Meter): | IN-LINE |
Technology: | CMOS |
JESD-30 Code: | R-PDIP-T14 |
Package Shape: | RECTANGULAR |
ROM Words: | 2048 |
Terminal Form: | THROUGH-HOLE |
Maximum Operating Temperature: | 85 Cel |
Package Code: | DIP |
Moisture Sensitivity Level (MSL): | 1 |
Speed: | 18 rpm |
RAM Bytes: | 256 |
Bit Size: | 8 |
JESD-609 Code: | e3 |
Minimum Operating Temperature: | -40 Cel |
Qualification: | Not Qualified |
Package Equivalence Code: | DIP14,.3 |
ROM Programmability: | FLASH |
Terminal Pitch: | 2.54 mm |
Temperature Grade: | INDUSTRIAL |
Power Supplies (V): | 2.5/3.3 |
CPU Family: | 8051 |