NXP Semiconductors - P89LPC931FDH,112

P89LPC931FDH,112 by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number P89LPC931FDH,112
Description MICROCONTROLLER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: TSSOP; Package Shape: RECTANGULAR;
Datasheet P89LPC931FDH,112 Datasheet
In Stock4,938
NAME DESCRIPTION
Minimum Supply Voltage: 3 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 3.3 V
Maximum Time At Peak Reflow Temperature (s): 30
Maximum Seated Height: 1.1 mm
Sub-Category: Microcontrollers
Surface Mount: YES
Maximum Supply Current: 18 mA
Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)
ADC Channels: NO
No. of Terminals: 28
DMA Channels: NO
Terminal Position: DUAL
Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
No. of I/O Lines: 26
Address Bus Width: 0
Technology: CMOS
JESD-30 Code: R-PDSO-G28
Maximum Clock Frequency: 18 MHz
Package Shape: RECTANGULAR
ROM Words: 8192
Terminal Form: GULL WING
Maximum Operating Temperature: 85 Cel
Package Code: TSSOP
Width: 4.4 mm
Moisture Sensitivity Level (MSL): 1
Speed: 18 rpm
Peripheral IC Type: MICROCONTROLLER
Maximum Supply Voltage: 3.6 V
RAM Bytes: 256
External Data Bus Width: 0
Bit Size: 8
DAC Channels: NO
JESD-609 Code: e4
Minimum Operating Temperature: -45 Cel
Qualification: Not Qualified
Package Equivalence Code: TSSOP28,.25
Length: 9.7 mm
PWM Channels: YES
Additional Features: OPERATES AT 2.4V MINIMUM SUPPLY @ 12 MHZ
Peak Reflow Temperature (C): 260
ROM Programmability: FLASH
Terminal Pitch: .65 mm
Temperature Grade: INDUSTRIAL
Power Supplies (V): 2.5/3.3
CPU Family: 8051
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