NXP Semiconductors - P89LPC933FDH-S

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P89LPC933FDH-S by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number P89LPC933FDH-S
Description Microcontrollers; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: TSSOP; Package Shape: RECTANGULAR;
Datasheet P89LPC933FDH-S Datasheet
In Stock3,829
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Speed: 18 rpm
RAM Bytes: 768
Sub-Category: Microcontrollers
Surface Mount: YES
Bit Size: 8
Maximum Supply Current: 23 mA
Minimum Operating Temperature: -40 Cel
No. of Terminals: 28
Qualification: Not Qualified
Package Equivalence Code: TSSOP28,.25
Terminal Position: DUAL
Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
JESD-30 Code: R-PDSO-G28
Package Shape: RECTANGULAR
ROM Words: 4096
Terminal Form: GULL WING
Maximum Operating Temperature: 85 Cel
Package Code: TSSOP
ROM Programmability: FLASH
Terminal Pitch: .635 mm
Temperature Grade: INDUSTRIAL
Power Supplies (V): 2.5/3.3
CPU Family: 8051
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