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Manufacturer | NXP Semiconductors |
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Manufacturer's Part Number | P89LPC933HDH,518 |
Description | Microcontrollers; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: TSSOP; Package Shape: RECTANGULAR; |
Datasheet | P89LPC933HDH,518 Datasheet |
In Stock | 3,633 |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Maximum Time At Peak Reflow Temperature (s): | 30 |
Sub-Category: | Microcontrollers |
Surface Mount: | YES |
Maximum Supply Current: | 23 mA |
Terminal Finish: | NICKEL PALLADIUM GOLD |
No. of Terminals: | 28 |
Terminal Position: | DUAL |
Package Style (Meter): | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
Technology: | CMOS |
JESD-30 Code: | R-PDSO-G28 |
Package Shape: | RECTANGULAR |
ROM Words: | 4096 |
Terminal Form: | GULL WING |
Maximum Operating Temperature: | 125 Cel |
Package Code: | TSSOP |
Moisture Sensitivity Level (MSL): | 2 |
Speed: | 18 rpm |
RAM Bytes: | 768 |
Bit Size: | 8 |
JESD-609 Code: | e4 |
Minimum Operating Temperature: | -40 Cel |
Qualification: | Not Qualified |
Package Equivalence Code: | TSSOP28,.25 |
Peak Reflow Temperature (C): | 260 |
ROM Programmability: | FLASH |
Terminal Pitch: | .635 mm |
Temperature Grade: | AUTOMOTIVE |
Power Supplies (V): | 2.5/3.3 |
CPU Family: | 8051 |