NXP Semiconductors - PCA9601DP,118

PCA9601DP,118 by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number PCA9601DP,118
Description BUS BUFFERS; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: TSSOP; Package Shape: RECTANGULAR; Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH;
Datasheet PCA9601DP,118 Datasheet
In Stock1,482
NAME DESCRIPTION
Minimum Supply Voltage: 2.5 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 5 V
Maximum Time At Peak Reflow Temperature (s): 30
Maximum Seated Height: 1.1 mm
Surface Mount: YES
No. of Terminals: 8
Terminal Position: DUAL
Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
JESD-30 Code: S-PDSO-G8
Package Shape: RECTANGULAR
Terminal Form: GULL WING
Maximum Operating Temperature: 85 Cel
Package Code: TSSOP
Interface IC Type: BUS BUFFERS
Width: 3 mm
Moisture Sensitivity Level (MSL): 1
Other Names: 935290859431
935290859118
568-5302-6
PCA9601DP118
568-5302-1
568-5302-2
Maximum Supply Voltage: 15 V
Minimum Operating Temperature: -40 Cel
No. of Functions: 1
Package Equivalence Code: TSSOP8,.19
Length: 3 mm
Peak Reflow Temperature (C): 260
Terminal Pitch: .65 mm
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