NXP Semiconductors - PCA9601DP,118

PCA9601DP,118 by NXP Semiconductors

Image shown is a representation only.

Manufacturer NXP Semiconductors
Manufacturer's Part Number PCA9601DP,118
Description BUS BUFFERS; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: TSSOP; Package Shape: RECTANGULAR; Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH;
Datasheet PCA9601DP,118 Datasheet
In Stock1,482
NAME DESCRIPTION
Minimum Supply Voltage: 2.5 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 5 V
Maximum Time At Peak Reflow Temperature (s): 30
Maximum Supply Voltage: 15 V
Maximum Seated Height: 1.1 mm
Surface Mount: YES
Minimum Operating Temperature: -40 Cel
No. of Functions: 1
No. of Terminals: 8
Package Equivalence Code: TSSOP8,.19
Terminal Position: DUAL
Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Length: 3 mm
JESD-30 Code: S-PDSO-G8
Package Shape: RECTANGULAR
Terminal Form: GULL WING
Maximum Operating Temperature: 85 Cel
Peak Reflow Temperature (C): 260
Package Code: TSSOP
Interface IC Type: BUS BUFFERS
Width: 3 mm
Terminal Pitch: .65 mm
Moisture Sensitivity Level (MSL): 1
Plant 5!
Your quote plants 5 trees.

Pricing (USD)

Qty. Unit Price Ext. Price
1,482 - -

Popular Products

Category Top Products