NXP Semiconductors - PCD3327CU

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PCD3327CU by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number PCD3327CU
Description TELEPHONE DIALER CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 18; Package Code: DIE; Package Shape: RECTANGULAR;
Datasheet PCD3327CU Datasheet
In Stock3,884
NAME DESCRIPTION
Package Body Material: UNSPECIFIED
Telecom IC Type: TELEPHONE DIALER CIRCUIT
Surface Mount: YES
Minimum Operating Temperature: -25 Cel
Make-break Ratio: 3:2
No. of Functions: 1
No. of Terminals: 18
Qualification: Not Qualified
Terminal Position: UPPER
Package Style (Meter): UNCASED CHIP
JESD-30 Code: R-XUUC-N18
Package Shape: RECTANGULAR
Terminal Form: NO LEAD
Additional Features: SELECTABLE MAKE/BREAK RATIO 2:1
Maximum Operating Temperature: 70 Cel
Package Code: DIE
Temperature Grade: OTHER
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