Image shown is a representation only.
| Manufacturer | NXP Semiconductors |
|---|---|
| Manufacturer's Part Number | PCD3332-1P |
| Description | TELEPHONE MULTIFUNCTION CIRCUIT; Temperature Grade: OTHER; Terminal Form: THROUGH-HOLE; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; |
| Datasheet | PCD3332-1P Datasheet |
| In Stock | 1,047 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Telecom IC Type: | TELEPHONE MULTIFUNCTION CIRCUIT |
| Maximum Seated Height: | 5.1 mm |
| Surface Mount: | NO |
| Minimum Operating Temperature: | -25 Cel |
| Make-break Ratio: | 3:2 |
| No. of Functions: | 1 |
| No. of Terminals: | 28 |
| Qualification: | Not Qualified |
| Terminal Position: | DUAL |
| Package Style (Meter): | IN-LINE |
| Length: | 35.5 mm |
| JESD-30 Code: | R-PDIP-T28 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | THROUGH-HOLE |
| Additional Features: | SELECTABLE MAKE/BREAK RATIO 2:1 |
| Maximum Operating Temperature: | 70 Cel |
| Package Code: | DIP |
| Width: | 15.24 mm |
| Terminal Pitch: | 2.54 mm |
| Temperature Grade: | OTHER |
