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Manufacturer | NXP Semiconductors |
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Manufacturer's Part Number | PCIMX535DVV1C |
Description | MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 529; Package Code: FBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, FINE PITCH; |
In Stock | 3,380 |
NAME | DESCRIPTION |
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Minimum Supply Voltage: | 1.2 V |
Package Body Material: | PLASTIC/EPOXY |
Peripheral IC Type: | MICROPROCESSOR CIRCUIT |
Nominal Supply Voltage: | 1.25 V |
Maximum Supply Voltage: | 1.3 V |
Maximum Seated Height: | 1.85 mm |
Surface Mount: | YES |
JESD-609 Code: | e2 |
No. of Terminals: | 529 |
Qualification: | Not Qualified |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, FINE PITCH |
Length: | 19 mm |
Technology: | CMOS |
JESD-30 Code: | S-PBGA-B529 |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Package Code: | FBGA |
Width: | 19 mm |
Terminal Pitch: | .8 mm |
Moisture Sensitivity Level (MSL): | 3 |