NXP Semiconductors - PEMB9,315

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PEMB9,315 by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number PEMB9,315
Description PNP; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Terminal Finish: TIN; No. of Elements: 2; Maximum Time At Peak Reflow Temperature (s): 30;
Datasheet PEMB9,315 Datasheet
In Stock402,567
NAME DESCRIPTION
Maximum Power Dissipation (Abs): .2 W
Maximum Time At Peak Reflow Temperature (s): 30
Transistor Element Material: SILICON
No. of Elements: 2
Sub-Category: BIP General Purpose Small Signal
Peak Reflow Temperature (C): 260
Polarity or Channel Type: PNP
Surface Mount: YES
Minimum DC Current Gain (hFE): 100
Terminal Finish: TIN
JESD-609 Code: e3
Moisture Sensitivity Level (MSL): 1
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Pricing (USD)

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