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| Manufacturer | NXP Semiconductors |
|---|---|
| Manufacturer's Part Number | PMGD130UN,115 |
| Description | N-CHANNEL; Surface Mount: YES; Maximum Power Dissipation (Abs): .39 W; Maximum Operating Temperature: 150 Cel; Terminal Finish: TIN; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR; |
| Datasheet | PMGD130UN,115 Datasheet |
| In Stock | 1,710 |
| NAME | DESCRIPTION |
|---|---|
| Other Names: |
568-10792-1 2156-PMGD130UN115-NXTR-ND 2156-PMGD130UN,115-ND PMGD130UN,115-ND 2156-PMGD130UN115 NEXNXPPMGD130UN,115 568-10792-6 568-10792-2 934066755115 |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Field Effect Transistor Technology: | METAL-OXIDE SEMICONDUCTOR |
| Maximum Drain Current (ID): | 1.3 A |
| Sub-Category: | FET General Purpose Power |
| Polarity or Channel Type: | N-CHANNEL |
| Surface Mount: | YES |
| Terminal Finish: | TIN |
| JESD-609 Code: | e3 |
| Maximum Power Dissipation (Abs): | .39 W |
| Operating Mode: | ENHANCEMENT MODE |
| Maximum Operating Temperature: | 150 Cel |
| Maximum Drain Current (Abs) (ID): | 1.3 A |
| Peak Reflow Temperature (C): | 260 |
| Moisture Sensitivity Level (MSL): | 1 |









