NXP Semiconductors - PNX1700EH/G,557

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PNX1700EH/G,557 by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number PNX1700EH/G,557
Description CONSUMER CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 456; Package Code: BGA; Package Shape: RECTANGULAR;
Datasheet PNX1700EH/G,557 Datasheet
In Stock3,409
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Time At Peak Reflow Temperature (s): 30
Maximum Seated Height: 2.45 mm
Minimum Supply Voltage (Vsup): 1.23 V
Surface Mount: YES
No. of Terminals: 456
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
Technology: CMOS
JESD-30 Code: R-PBGA-B456
Package Shape: RECTANGULAR
Terminal Form: BALL
Maximum Operating Temperature: 85 Cel
Package Code: BGA
General IC Type: CONSUMER CIRCUIT
Width: 27 mm
Moisture Sensitivity Level (MSL): 3
Minimum Operating Temperature: 0 Cel
No. of Functions: 1
Qualification: Not Qualified
Length: 27 mm
Peak Reflow Temperature (C): 250
Terminal Pitch: 1 mm
Temperature Grade: OTHER
Maximum Supply Voltage (Vsup): 1.37 V
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