NXP Semiconductors - PPC7447RX867NB

PPC7447RX867NB by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number PPC7447RX867NB
Description MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 360; Package Code: BGA; Package Shape: SQUARE; Terminal Finish: TIN LEAD;
Datasheet PPC7447RX867NB Datasheet
In Stock3,975
NAME DESCRIPTION
Package Body Material: CERAMIC
Speed: 867 rpm
Peripheral IC Type: MICROPROCESSOR, RISC
Maximum Time At Peak Reflow Temperature (s): 30
Sub-Category: Microprocessors
Surface Mount: YES
Bit Size: 32
Terminal Finish: TIN LEAD
JESD-609 Code: e0
No. of Terminals: 360
Qualification: Not Qualified
Package Equivalence Code: BGA360,19X19,50
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
Technology: CMOS
JESD-30 Code: S-XBGA-B360
Package Shape: SQUARE
Terminal Form: BALL
Peak Reflow Temperature (C): 220
Package Code: BGA
Terminal Pitch: 1.27 mm
Power Supplies (V): 1.1,1.8/2.5
Moisture Sensitivity Level (MSL): 1
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