NXP Semiconductors - PTM1300FBEA

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PTM1300FBEA by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number PTM1300FBEA
Description CONSUMER CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 292; Package Code: HBGA; Package Shape: SQUARE;
Datasheet PTM1300FBEA Datasheet
In Stock1,754
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Seated Height: 2.55 mm
Minimum Supply Voltage (Vsup): 2.375 V
Surface Mount: YES
Maximum Supply Current: 1200 mA
Minimum Operating Temperature: 0 Cel
No. of Functions: 1
No. of Terminals: 292
Qualification: Not Qualified
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG
Length: 27 mm
JESD-30 Code: S-PBGA-B292
Package Shape: SQUARE
Terminal Form: BALL
Additional Features: ALSO REQUIRES CORE SUPPLY OF 2.5 V, 1.2 A
Maximum Operating Temperature: 85 Cel
Package Code: HBGA
General IC Type: CONSUMER CIRCUIT
Width: 27 mm
Terminal Pitch: 1.27 mm
Temperature Grade: OTHER
Maximum Supply Voltage (Vsup): 2.625 V
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