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| Manufacturer | NXP Semiconductors |
|---|---|
| Manufacturer's Part Number | PX1011BI-EL1/G,557 |
| Description | INTERFACE CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 81; Package Code: LFBGA; Package Shape: SQUARE; |
| Datasheet | PX1011BI-EL1/G,557 Datasheet |
| In Stock | 1,489 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 1.2 V |
| Telecom IC Type: | INTERFACE CIRCUIT |
| Maximum Seated Height: | 1.6 mm |
| Surface Mount: | YES |
| Minimum Operating Temperature: | -40 Cel |
| No. of Functions: | 1 |
| No. of Terminals: | 81 |
| Qualification: | Not Qualified |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, LOW PROFILE, FINE PITCH |
| Length: | 9 mm |
| JESD-30 Code: | S-PBGA-B81 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 85 Cel |
| Peak Reflow Temperature (C): | 260 |
| Package Code: | LFBGA |
| Width: | 9 mm |
| Terminal Pitch: | .8 mm |
| Temperature Grade: | INDUSTRIAL |
| Moisture Sensitivity Level (MSL): | 3 |
