NXP Semiconductors - S9S12DG12F1VFUE

S9S12DG12F1VFUE by NXP Semiconductors

Image shown is a representation only.

Manufacturer NXP Semiconductors
Manufacturer's Part Number S9S12DG12F1VFUE
Description MICROCONTROLLER; Terminal Form: GULL WING; No. of Terminals: 80; Package Code: HQFP; Package Shape: SQUARE; JESD-609 Code: e3;
Datasheet S9S12DG12F1VFUE Datasheet
In Stock3,698
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Integrated Cache: NO
Maximum Time At Peak Reflow Temperature (s): 40
Maximum Seated Height: 2.45 mm
Surface Mount: YES
Terminal Finish: TIN
ADC Channels: NO
No. of Terminals: 80
DMA Channels: NO
Terminal Position: QUAD
Format: FIXED POINT
Package Style (Meter): FLATPACK, HEAT SINK/SLUG
Address Bus Width: 0
Technology: CMOS
JESD-30 Code: S-PQFP-G80
Package Shape: SQUARE
ROM Words: 131072
Terminal Form: GULL WING
Maximum Operating Temperature: 105 Cel
Package Code: HQFP
Width: 14 mm
Moisture Sensitivity Level (MSL): 3
Data EEPROM Size: 0
Speed: 25 rpm
Peripheral IC Type: MICROCONTROLLER
RAM Bytes: 0
Low Power Mode: NO
Boundary Scan: NO
External Data Bus Width: 0
Bit Size: 16
DAC Channels: NO
JESD-609 Code: e3
Minimum Operating Temperature: -40 Cel
Length: 14 mm
PWM Channels: NO
On Chip Program ROM Width: 8
Peak Reflow Temperature (C): 260
ROM Programmability: FLASH
Terminal Pitch: .65 mm
CPU Family: S12
Plant 5!
Your quote plants 5 trees.

Pricing (USD)

Qty. Unit Price Ext. Price
3,698 - -

Popular Products

Category Top Products