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Manufacturer | NXP Semiconductors |
---|---|
Manufacturer's Part Number | S9S12DG12F1VFUE |
Description | MICROCONTROLLER; Terminal Form: GULL WING; No. of Terminals: 80; Package Code: HQFP; Package Shape: SQUARE; JESD-609 Code: e3; |
Datasheet | S9S12DG12F1VFUE Datasheet |
In Stock | 3,698 |
NAME | DESCRIPTION |
---|---|
Package Body Material: | PLASTIC/EPOXY |
Integrated Cache: | NO |
Maximum Time At Peak Reflow Temperature (s): | 40 |
Maximum Seated Height: | 2.45 mm |
Surface Mount: | YES |
Terminal Finish: | TIN |
ADC Channels: | NO |
No. of Terminals: | 80 |
DMA Channels: | NO |
Terminal Position: | QUAD |
Format: | FIXED POINT |
Package Style (Meter): | FLATPACK, HEAT SINK/SLUG |
Address Bus Width: | 0 |
Technology: | CMOS |
JESD-30 Code: | S-PQFP-G80 |
Package Shape: | SQUARE |
ROM Words: | 131072 |
Terminal Form: | GULL WING |
Maximum Operating Temperature: | 105 Cel |
Package Code: | HQFP |
Width: | 14 mm |
Moisture Sensitivity Level (MSL): | 3 |
Data EEPROM Size: | 0 |
Speed: | 25 rpm |
Peripheral IC Type: | MICROCONTROLLER |
RAM Bytes: | 0 |
Low Power Mode: | NO |
Boundary Scan: | NO |
External Data Bus Width: | 0 |
Bit Size: | 16 |
DAC Channels: | NO |
JESD-609 Code: | e3 |
Minimum Operating Temperature: | -40 Cel |
Length: | 14 mm |
PWM Channels: | NO |
On Chip Program ROM Width: | 8 |
Peak Reflow Temperature (C): | 260 |
ROM Programmability: | FLASH |
Terminal Pitch: | .65 mm |
CPU Family: | S12 |