NXP Semiconductors - S9S12DG12F1VPVER

S9S12DG12F1VPVER by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number S9S12DG12F1VPVER
Description MICROCONTROLLER; Terminal Form: GULL WING; No. of Terminals: 112; Package Code: QFP; Package Shape: SQUARE; ROM Programmability: FLASH;
Datasheet S9S12DG12F1VPVER Datasheet
In Stock2,721
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Integrated Cache: NO
Maximum Time At Peak Reflow Temperature (s): 40
Surface Mount: YES
ADC Channels: NO
No. of Terminals: 112
DMA Channels: NO
Terminal Position: QUAD
Format: FIXED POINT
Package Style (Meter): FLATPACK
Address Bus Width: 0
Screening Level: AEC-Q100
Technology: CMOS
JESD-30 Code: S-PQFP-G112
Package Shape: SQUARE
ROM Words: 131072
Terminal Form: GULL WING
Maximum Operating Temperature: 105 Cel
Package Code: QFP
Moisture Sensitivity Level (MSL): 3
Speed: 25 rpm
Peripheral IC Type: MICROCONTROLLER
Low Power Mode: NO
Boundary Scan: NO
External Data Bus Width: 0
Bit Size: 16
DAC Channels: NO
Minimum Operating Temperature: -40 Cel
PWM Channels: NO
On Chip Program ROM Width: 8
Peak Reflow Temperature (C): 260
ROM Programmability: FLASH
CPU Family: S9S12
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