NXP Semiconductors - S9S12DT25F0MPVER

S9S12DT25F0MPVER by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number S9S12DT25F0MPVER
Description MICROCONTROLLER; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 112; Package Code: LFQFP; Package Shape: SQUARE;
Datasheet S9S12DT25F0MPVER Datasheet
In Stock4,977
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 5 V
Maximum Time At Peak Reflow Temperature (s): 40
Maximum Seated Height: 1.6 mm
Surface Mount: YES
Terminal Finish: TIN
ADC Channels: YES
No. of Terminals: 112
DMA Channels: NO
Terminal Position: QUAD
Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH
No. of I/O Lines: 91
Address Bus Width: 16
Technology: CMOS
JESD-30 Code: S-PQFP-G112
Maximum Clock Frequency: 16 MHz
Package Shape: SQUARE
Terminal Form: GULL WING
Maximum Operating Temperature: 125 Cel
Package Code: LFQFP
Width: 20 mm
Moisture Sensitivity Level (MSL): 3
Speed: 25 rpm
Peripheral IC Type: MICROCONTROLLER
External Data Bus Width: 16
Bit Size: 16
DAC Channels: NO
JESD-609 Code: e3
Minimum Operating Temperature: -40 Cel
Length: 20 mm
PWM Channels: NO
On Chip Program ROM Width: 8
Peak Reflow Temperature (C): 260
ROM Programmability: FLASH
Terminal Pitch: .5 mm
Temperature Grade: AUTOMOTIVE
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