Image shown is a representation only.
| Manufacturer | NXP Semiconductors |
|---|---|
| Manufacturer's Part Number | SA58646BD,118 |
| Description | TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: LFQFP; Package Shape: SQUARE; |
| Datasheet | SA58646BD,118 Datasheet |
| In Stock | 1,293 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 3 V |
| Telecom IC Type: | TELECOM CIRCUIT |
| Maximum Seated Height: | 1.6 mm |
| Surface Mount: | YES |
| Terminal Finish: | TIN |
| JESD-609 Code: | e3 |
| Minimum Operating Temperature: | -40 Cel |
| No. of Functions: | 1 |
| No. of Terminals: | 64 |
| Qualification: | Not Qualified |
| Terminal Position: | QUAD |
| Package Style (Meter): | FLATPACK, LOW PROFILE, FINE PITCH |
| Length: | 10 mm |
| Technology: | BICMOS |
| JESD-30 Code: | S-PQFP-G64 |
| Package Shape: | SQUARE |
| Terminal Form: | GULL WING |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | LFQFP |
| Width: | 10 mm |
| Terminal Pitch: | .5 mm |
| Temperature Grade: | INDUSTRIAL |
| Moisture Sensitivity Level (MSL): | 1 |
