SA58646BD,118 by NXP Semiconductors | Telecommunications

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Manufacturer	NXP Semiconductors
Manufacturer's Part Number	SA58646BD,118
Description	TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: LFQFP; Package Shape: SQUARE;
Datasheet	SA58646BD,118 Datasheet
In Stock	1,398

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Nominal Supply Voltage:	3 V
Maximum Seated Height:	1.6 mm
Surface Mount:	YES
Terminal Finish:	TIN
No. of Terminals:	64
Terminal Position:	QUAD
Package Style (Meter):	FLATPACK, LOW PROFILE, FINE PITCH
Technology:	BICMOS
JESD-30 Code:	S-PQFP-G64
Package Shape:	SQUARE
Terminal Form:	GULL WING
Maximum Operating Temperature:	85 Cel
Package Code:	LFQFP
Width:	10 mm
Moisture Sensitivity Level (MSL):	1
Other Names:	935280879118 568-4004-6 SA58646BD-T 568-4004-2 SA58646BD118 568-4004-1
Telecom IC Type:	TELECOM CIRCUIT
JESD-609 Code:	e3
Minimum Operating Temperature:	-40 Cel
No. of Functions:	1
Qualification:	Not Qualified
Length:	10 mm
Terminal Pitch:	.5 mm
Temperature Grade:	INDUSTRIAL

Pricing (USD)

Qty.	Unit Price	Ext. Price
1,398	-	-

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