NXP Semiconductors - SC5554MZP132

SC5554MZP132 by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number SC5554MZP132
Description Microcontrollers; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 416; Package Code: BGA; Package Shape: SQUARE;
Datasheet SC5554MZP132 Datasheet
In Stock2,657
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Time At Peak Reflow Temperature (s): 30
Sub-Category: Microcontrollers
Surface Mount: YES
Maximum Supply Current: 875 mA
No. of Terminals: 416
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
Technology: CMOS
JESD-30 Code: S-PBGA-B416
Package Shape: SQUARE
ROM Words: 2097152
Terminal Form: BALL
Maximum Operating Temperature: 125 Cel
Package Code: BGA
Moisture Sensitivity Level (MSL): 3
Speed: 132 rpm
RAM Bytes: 65536
Bit Size: 32
Minimum Operating Temperature: -40 Cel
Qualification: Not Qualified
Package Equivalence Code: BGA416,26X26,40
Peak Reflow Temperature (C): 245
ROM Programmability: FLASH
Terminal Pitch: 1 mm
Temperature Grade: AUTOMOTIVE
Power Supplies (V): 1.5,3.3,5
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