
Image shown is a representation only.
Manufacturer | NXP Semiconductors |
---|---|
Manufacturer's Part Number | SC900841JVKR2 |
Description | POWER SUPPLY MANAGEMENT CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 338; Package Code: TFBGA; Package Shape: SQUARE; Surface Mount: YES; |
Datasheet | SC900841JVKR2 Datasheet |
In Stock | 2,738 |
NAME | DESCRIPTION |
---|---|
Package Body Material: | PLASTIC/EPOXY |
Width (mm): | 11 mm |
Maximum Seated Height: | 1.2 mm |
Minimum Supply Voltage (Vsup): | 3 V |
Surface Mount: | YES |
Minimum Operating Temperature: | -40 Cel |
No. of Functions: | 1 |
No. of Terminals: | 338 |
Package Equivalence Code: | BGA338,29X29,14 |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, THIN PROFILE, FINE PITCH |
Other IC type: | POWER SUPPLY MANAGEMENT CIRCUIT |
Length: | 11 mm |
JESD-30 Code: | S-PBGA-B338 |
Adjustable Threshold: | YES |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Maximum Operating Temperature: | 85 Cel |
No. of Channels: | 25 |
Package Code: | TFBGA |
Nominal Supply Voltage (Vsup): | 3.6 V |
Terminal Pitch: | .353 mm |
Temperature Grade: | INDUSTRIAL |
Maximum Supply Voltage (Vsup): | 4.4 V |