NXP Semiconductors - SC900841JVKR2

SC900841JVKR2 by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number SC900841JVKR2
Description POWER SUPPLY MANAGEMENT CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 338; Package Code: TFBGA; Package Shape: SQUARE; Surface Mount: YES;
Datasheet SC900841JVKR2 Datasheet
In Stock2,738
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Width (mm): 11 mm
Maximum Seated Height: 1.2 mm
Minimum Supply Voltage (Vsup): 3 V
Surface Mount: YES
Minimum Operating Temperature: -40 Cel
No. of Functions: 1
No. of Terminals: 338
Package Equivalence Code: BGA338,29X29,14
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH
Other IC type: POWER SUPPLY MANAGEMENT CIRCUIT
Length: 11 mm
JESD-30 Code: S-PBGA-B338
Adjustable Threshold: YES
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 85 Cel
No. of Channels: 25
Package Code: TFBGA
Nominal Supply Voltage (Vsup): 3.6 V
Terminal Pitch: .353 mm
Temperature Grade: INDUSTRIAL
Maximum Supply Voltage (Vsup): 4.4 V
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