NXP Semiconductors - SCF5249VF140

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SCF5249VF140 by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number SCF5249VF140
Description MICROPROCESSOR, RISC; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 160; Package Code: BGA; Package Shape: SQUARE;
Datasheet SCF5249VF140 Datasheet
In Stock2,667
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 1.8 V
Integrated Cache: YES
Maximum Time At Peak Reflow Temperature (s): 40
Maximum Seated Height: 1.75 mm
Sub-Category: Microprocessors
Surface Mount: YES
Terminal Finish: Tin/Lead/Silver (Sn/Pb/Ag)
No. of Terminals: 160
Terminal Position: BOTTOM
Format: FIXED POINT
Package Style (Meter): GRID ARRAY
Address Bus Width: 24
Technology: CMOS
JESD-30 Code: S-PBGA-B160
Maximum Clock Frequency: 33.86 MHz
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 70 Cel
Package Code: BGA
Width: 15 mm
Moisture Sensitivity Level (MSL): 3
Speed: 140 rpm
Peripheral IC Type: MICROPROCESSOR, RISC
Low Power Mode: YES
Boundary Scan: YES
External Data Bus Width: 16
Bit Size: 32
JESD-609 Code: e0
Minimum Operating Temperature: -20 Cel
Qualification: Not Qualified
Package Equivalence Code: BGA160,14X14,40
Length: 15 mm
Peak Reflow Temperature (C): 260
Terminal Pitch: 1 mm
Temperature Grade: COMMERCIAL
Power Supplies (V): 3.3
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