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Manufacturer | NXP Semiconductors |
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Manufacturer's Part Number | SCP2207VMU |
Description | MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 236; Package Code: LFBGA; Package Shape: SQUARE; |
Datasheet | SCP2207VMU Datasheet |
In Stock | 3,648 |
NAME | DESCRIPTION |
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Minimum Supply Voltage: | .9 V |
Package Body Material: | PLASTIC/EPOXY |
Nominal Supply Voltage: | 1 V |
Integrated Cache: | YES |
Maximum Time At Peak Reflow Temperature (s): | NOT SPECIFIED |
Maximum Seated Height: | 1.34 mm |
Surface Mount: | YES |
No. of Terminals: | 236 |
Terminal Position: | BOTTOM |
Format: | FIXED POINT |
Package Style (Meter): | GRID ARRAY, LOW PROFILE, FINE PITCH |
Address Bus Width: | 13 |
Technology: | CMOS |
JESD-30 Code: | S-PBGA-B236 |
Maximum Clock Frequency: | 30 MHz |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Maximum Operating Temperature: | 105 Cel |
Package Code: | LFBGA |
Width: | 9 mm |
Speed: | 347.5 rpm |
Peripheral IC Type: | MICROPROCESSOR, RISC |
Maximum Supply Voltage: | 1.1 V |
Low Power Mode: | YES |
Boundary Scan: | YES |
External Data Bus Width: | 32 |
Bit Size: | 32 |
Minimum Operating Temperature: | -40 Cel |
Length: | 9 mm |
Peak Reflow Temperature (C): | NOT SPECIFIED |
Terminal Pitch: | .5 mm |
Temperature Grade: | INDUSTRIAL |