NXP Semiconductors - SL2S2002FUD,003

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SL2S2002FUD,003 by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number SL2S2002FUD,003
Description TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 4; Package Code: DIE; Package Shape: UNSPECIFIED;
Datasheet SL2S2002FUD,003 Datasheet
In Stock4,811
NAME DESCRIPTION
Package Body Material: UNSPECIFIED
Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED
Telecom IC Type: TELECOM CIRCUIT
Surface Mount: YES
Minimum Operating Temperature: -40 Cel
No. of Functions: 1
No. of Terminals: 4
Terminal Position: UPPER
Package Style (Meter): UNCASED CHIP
Technology: CMOS
JESD-30 Code: X-XUUC-N4
Package Shape: UNSPECIFIED
Terminal Form: NO LEAD
Maximum Operating Temperature: 85 Cel
Peak Reflow Temperature (C): NOT SPECIFIED
Package Code: DIE
Temperature Grade: INDUSTRIAL
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