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| Manufacturer | NXP Semiconductors |
|---|---|
| Manufacturer's Part Number | SL2S5302FUD,003 |
| Description | TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 4; Package Code: DIE; Package Shape: RECTANGULAR; |
| Datasheet | SL2S5302FUD,003 Datasheet |
| In Stock | 1,269 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | UNSPECIFIED |
| Maximum Time At Peak Reflow Temperature (s): | NOT SPECIFIED |
| Telecom IC Type: | TELECOM CIRCUIT |
| Surface Mount: | YES |
| Minimum Operating Temperature: | -40 Cel |
| No. of Functions: | 1 |
| No. of Terminals: | 4 |
| Terminal Position: | UPPER |
| Package Style (Meter): | UNCASED CHIP |
| Technology: | CMOS |
| JESD-30 Code: | R-XUUC-N4 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | NO LEAD |
| Maximum Operating Temperature: | 85 Cel |
| Peak Reflow Temperature (C): | NOT SPECIFIED |
| Package Code: | DIE |
| Temperature Grade: | INDUSTRIAL |
