NXP Semiconductors - SL2S5302FUD

SL2S5302FUD by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number SL2S5302FUD
Description TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 4; Package Code: DIE; Package Shape: RECTANGULAR;
Datasheet SL2S5302FUD Datasheet
In Stock742
NAME DESCRIPTION
Package Body Material: UNSPECIFIED
Telecom IC Type: TELECOM CIRCUIT
Surface Mount: YES
Minimum Operating Temperature: -40 Cel
No. of Functions: 1
No. of Terminals: 4
Qualification: Not Qualified
Terminal Position: UPPER
Package Style (Meter): UNCASED CHIP
Technology: CMOS
JESD-30 Code: R-XUUC-N4
Package Shape: RECTANGULAR
Terminal Form: NO LEAD
Maximum Operating Temperature: 85 Cel
Package Code: DIE
Temperature Grade: INDUSTRIAL
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