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| Manufacturer | NXP Semiconductors |
|---|---|
| Manufacturer's Part Number | SL3S1002FTB1,115 |
| Description | TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BUTT; No. of Terminals: 3; Package Code: BCC; Package Shape: RECTANGULAR; |
| Datasheet | SL3S1002FTB1,115 Datasheet |
| In Stock | 7,308 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Maximum Seated Height: | .5 mm |
| Sub-Category: | Other Telecom ICs |
| Surface Mount: | YES |
| Terminal Finish: | TIN |
| No. of Terminals: | 3 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | CHIP CARRIER |
| Technology: | CMOS |
| JESD-30 Code: | R-PBCC-B3 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BUTT |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | BCC |
| Width: | 1 mm |
| Moisture Sensitivity Level (MSL): | 1 |
| Telecom IC Type: | TELECOM CIRCUIT |
| JESD-609 Code: | e3 |
| Minimum Operating Temperature: | -40 Cel |
| No. of Functions: | 1 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | LCC3(UNSPEC) |
| Length: | 1.45 mm |
| Peak Reflow Temperature (C): | 260 |
| Terminal Pitch: | .55 mm |
| Temperature Grade: | INDUSTRIAL |
