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| Manufacturer | NXP Semiconductors |
|---|---|
| Manufacturer's Part Number | SPC5517GAVMG80 |
| Description | MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 208; Package Code: BGA; Package Shape: SQUARE; |
| In Stock | 507 |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | 4.5 V |
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 5 V |
| Maximum Time At Peak Reflow Temperature (s): | 40 |
| Sub-Category: | Microcontrollers |
| Surface Mount: | YES |
| Terminal Finish: | TIN SILVER |
| ADC Channels: | YES |
| No. of Terminals: | 208 |
| DMA Channels: | YES |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY |
| Address Bus Width: | 0 |
| Screening Level: | AEC-Q100 |
| Technology: | CMOS |
| JESD-30 Code: | S-PBGA-B208 |
| Package Shape: | SQUARE |
| ROM Words: | 196608 |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 105 Cel |
| Package Code: | BGA |
| Width: | 17 mm |
| Moisture Sensitivity Level (MSL): | 3 |
| Speed: | 80 rpm |
| Peripheral IC Type: | MICROCONTROLLER, RISC |
| Maximum Supply Voltage: | 5.25 V |
| RAM Bytes: | 81920 |
| External Data Bus Width: | 0 |
| Bit Size: | 32 |
| JESD-609 Code: | e2 |
| Minimum Operating Temperature: | -40 Cel |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA208,16X16,40 |
| Length: | 17 mm |
| PWM Channels: | YES |
| Peak Reflow Temperature (C): | 260 |
| ROM Programmability: | FLASH |
| Terminal Pitch: | 1 mm |
| Temperature Grade: | INDUSTRIAL |
| Power Supplies (V): | 5 |
| CPU Family: | E200 |
