NXP Semiconductors - SPC5553MZQ112

SPC5553MZQ112 by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number SPC5553MZQ112
Description MICROCONTROLLER; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 324; Package Code: BGA; Package Shape: SQUARE;
In Stock815
NAME DESCRIPTION
Minimum Supply Voltage: 1.35 V
Package Body Material: PLASTIC
Nominal Supply Voltage: 1.5 V
Maximum Time At Peak Reflow Temperature (s): 30
Sub-Category: Microcontrollers
Surface Mount: YES
Maximum Supply Current: 460 mA
ADC Channels: YES
No. of Terminals: 324
DMA Channels: NO
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
Address Bus Width: 24
Screening Level: AEC-Q100
Technology: CMOS
JESD-30 Code: S-PBGA-B324
Maximum Clock Frequency: 20 MHz
Package Shape: SQUARE
ROM Words: 1572864
Terminal Form: BALL
Maximum Operating Temperature: 125 Cel
Package Code: BGA
Width: 23 mm
Moisture Sensitivity Level (MSL): 3
Speed: 114 rpm
Peripheral IC Type: MICROCONTROLLER
Maximum Supply Voltage: 1.65 V
RAM Bytes: 65536
External Data Bus Width: 32
Bit Size: 32
Minimum Operating Temperature: -40 Cel
Qualification: Not Qualified
Package Equivalence Code: BGA324,22X22,40
Length: 23 mm
PWM Channels: YES
Peak Reflow Temperature (C): 245
ROM Programmability: FLASH
Terminal Pitch: 1 mm
Temperature Grade: AUTOMOTIVE
Power Supplies (V): 1.5,3.3,5
CPU Family: E200
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