SPC5566MZP80R by NXP Semiconductors | Peripheral ICs

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Manufacturer	NXP Semiconductors
Manufacturer's Part Number	SPC5566MZP80R
Description	MICROCONTROLLER, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 416; Package Code: BGA; Package Shape: SQUARE;
In Stock	800

NAME	DESCRIPTION
Minimum Supply Voltage:	1.35 V
Package Body Material:	PLASTIC/EPOXY
Nominal Supply Voltage:	1.5 V
Maximum Time At Peak Reflow Temperature (s):	40
Sub-Category:	Microcontrollers
Surface Mount:	YES
Maximum Supply Current:	545 mA
ADC Channels:	YES
No. of Terminals:	416
DMA Channels:	YES
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY
No. of I/O Lines:	256
Address Bus Width:	24
Screening Level:	AEC-Q100
Technology:	CMOS
JESD-30 Code:	S-PBGA-B416
Maximum Clock Frequency:	20 MHz
Package Shape:	SQUARE
ROM Words:	3145728
Terminal Form:	BALL
Maximum Operating Temperature:	125 Cel
Package Code:	BGA
Width:	27 mm
Moisture Sensitivity Level (MSL):	3
Speed:	82 rpm
Peripheral IC Type:	MICROCONTROLLER, RISC
Maximum Supply Voltage:	1.65 V
RAM Bytes:	131072
External Data Bus Width:	32
Bit Size:	32
Minimum Operating Temperature:	-40 Cel
Qualification:	Not Qualified
Package Equivalence Code:	BGA416,26X26,40
Length:	27 mm
PWM Channels:	YES
Peak Reflow Temperature (C):	260
ROM Programmability:	FLASH
Terminal Pitch:	1 mm
Temperature Grade:	AUTOMOTIVE
Power Supplies (V):	1.5,3.3,5
CPU Family:	E200

Pricing (USD)

Qty.	Unit Price	Ext. Price
800	-	-

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