NXP Semiconductors - SPC5607BCMG6

SPC5607BCMG6 by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number SPC5607BCMG6
Description MICROCONTROLLER, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 208; Package Code: BGA; Package Shape: SQUARE;
Datasheet SPC5607BCMG6 Datasheet
In Stock3,291
NAME DESCRIPTION
Minimum Supply Voltage: 3 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 3.3 V
Sub-Category: Microcontrollers
Surface Mount: YES
ADC Channels: YES
No. of Terminals: 208
DMA Channels: YES
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
No. of I/O Lines: 149
Address Bus Width: 0
Screening Level: AEC-Q100
Technology: CMOS
JESD-30 Code: S-PBGA-B208
Maximum Clock Frequency: 16 MHz
Package Shape: SQUARE
ROM Words: 1572864
Terminal Form: BALL
Maximum Operating Temperature: 125 Cel
Package Code: BGA
Width: 17 mm
Speed: 64 rpm
Peripheral IC Type: MICROCONTROLLER, RISC
Maximum Supply Voltage: 3.6 V
RAM Bytes: 98304
External Data Bus Width: 0
Bit Size: 32
Minimum Operating Temperature: -40 Cel
Qualification: Not Qualified
Package Equivalence Code: BGA208,16X16,40
Length: 17 mm
PWM Channels: YES
ROM Programmability: FLASH
Terminal Pitch: 1 mm
Temperature Grade: AUTOMOTIVE
Power Supplies (V): 3.3/5
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