SPC5642AF2MVZ2R by NXP Semiconductors | Peripheral ICs

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Manufacturer	NXP Semiconductors
Manufacturer's Part Number	SPC5642AF2MVZ2R
Description	Microcontrollers; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 324; Package Code: BGA; Package Shape: SQUARE;
In Stock	2,044

NAME	DESCRIPTION
Package Body Material:	PLASTIC
Nominal Supply Voltage:	1.2 V
Maximum Time At Peak Reflow Temperature (s):	40
Sub-Category:	Microcontrollers
Surface Mount:	YES
Maximum Supply Current:	360 mA
Terminal Finish:	TIN SILVER
No. of Terminals:	324
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY
Screening Level:	AEC-Q100
Technology:	CMOS
JESD-30 Code:	S-PBGA-B324
Package Shape:	SQUARE
ROM Words:	2097152
Terminal Form:	BALL
Maximum Operating Temperature:	125 Cel
Package Code:	BGA
Moisture Sensitivity Level (MSL):	3
Speed:	120 rpm
RAM Bytes:	131072
Bit Size:	32
JESD-609 Code:	e2
Minimum Operating Temperature:	-40 Cel
Qualification:	Not Qualified
Package Equivalence Code:	BGA324,22X22,40
Peak Reflow Temperature (C):	260
ROM Programmability:	FLASH
Terminal Pitch:	1 mm
Temperature Grade:	AUTOMOTIVE
Power Supplies (V):	1.2
CPU Family:	E200

Pricing (USD)

Qty.	Unit Price	Ext. Price
2,044	-	-

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