NXP Semiconductors - SPC5643LF2MMM1R

SPC5643LF2MMM1R by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number SPC5643LF2MMM1R
Description Microcontrollers; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 257; Package Code: FBGA; Package Shape: SQUARE;
Datasheet SPC5643LF2MMM1R Datasheet
In Stock432
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 3.3 V
Maximum Time At Peak Reflow Temperature (s): 40
Sub-Category: Microcontrollers
Surface Mount: YES
Maximum Supply Current: 380 mA
Terminal Finish: TIN SILVER
No. of Terminals: 257
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, FINE PITCH
Screening Level: AEC-Q100
Technology: CMOS
JESD-30 Code: S-PBGA-B257
Package Shape: SQUARE
ROM Words: 1048576
Terminal Form: BALL
Maximum Operating Temperature: 125 Cel
Package Code: FBGA
Moisture Sensitivity Level (MSL): 3
Speed: 120 rpm
RAM Bytes: 131072
Bit Size: 32
JESD-609 Code: e2
Minimum Operating Temperature: -40 Cel
Qualification: Not Qualified
Package Equivalence Code: BGA257,17X17,32
Peak Reflow Temperature (C): 260
ROM Programmability: FLASH
Terminal Pitch: .8 mm
Temperature Grade: AUTOMOTIVE
Power Supplies (V): 3.3
CPU Family: E200
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