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Manufacturer | NXP Semiconductors |
---|---|
Manufacturer's Part Number | SPC5643LFF2MMM1R |
Description | MICROCONTROLLER, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 257; Package Code: FBGA; Package Shape: SQUARE; |
Datasheet | SPC5643LFF2MMM1R Datasheet |
In Stock | 4,538 |
NAME | DESCRIPTION |
---|---|
Minimum Supply Voltage: | 3 V |
Package Body Material: | PLASTIC/EPOXY |
Integrated Cache: | YES |
Maximum Time At Peak Reflow Temperature (s): | 40 |
Surface Mount: | YES |
On Chip Data RAM Width: | 8 |
No. of DMA Channels: | 16 |
Address Bus Width: | 32 |
Screening Level: | AEC-Q100 |
Technology: | CMOS |
Maximum Clock Frequency: | 40 MHz |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Package Code: | FBGA |
Moisture Sensitivity Level (MSL): | 3 |
No. of External Interrupts: | 1 |
Bit Size: | 32 |
DAC Channels: | NO |
Package Equivalence Code: | BGA257,17X17,32 |
PWM Channels: | YES |
Connectivity: | CAN(2), DSPI(3), LIN(2) |
Peak Reflow Temperature (C): | 260 |
ROM Programmability: | FLASH |
Analog To Digital Convertors: | 16-Ch 12-Bit |
Terminal Pitch: | .8 mm |
CPU Family: | E200Z4 |
Nominal Supply Voltage: | 3.3 V |
Maximum Seated Height: | 1.51 mm |
Maximum Supply Current: | 318 mA |
ADC Channels: | YES |
No. of Terminals: | 257 |
No. of Timers: | 26 |
DMA Channels: | YES |
Terminal Position: | BOTTOM |
Format: | FIXED POINT |
Package Style (Meter): | GRID ARRAY, FINE PITCH |
No. of I/O Lines: | 133 |
JESD-30 Code: | S-PBGA-B257 |
ROM Words: | 1048576 |
Maximum Operating Temperature: | 125 Cel |
Width: | 14 mm |
Data EEPROM Size: | 0 |
Speed: | 120 rpm |
Peripheral IC Type: | MICROCONTROLLER, RISC |
Maximum Supply Voltage: | 3.63 V |
RAM Bytes: | 131072 |
Low Power Mode: | YES |
Boundary Scan: | YES |
External Data Bus Width: | 64 |
Peripherals: | DMA(16), POR, PWM(4), TIMER(26), WDT |
Minimum Operating Temperature: | -40 Cel |
Length: | 14 mm |
On Chip Program ROM Width: | 8 |
Temperature Grade: | AUTOMOTIVE |