SPC5646CF0MMJ1 by NXP Semiconductors | Peripheral ICs

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Manufacturer	NXP Semiconductors
Manufacturer's Part Number	SPC5646CF0MMJ1
Description	MICROCONTROLLER, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;
In Stock	2,860

NAME	DESCRIPTION
Minimum Supply Voltage:	3 V
Package Body Material:	PLASTIC
Nominal Supply Voltage:	3.3 V
Maximum Time At Peak Reflow Temperature (s):	40
Sub-Category:	Microcontrollers
Surface Mount:	YES
Maximum Supply Current:	300 mA
Terminal Finish:	TIN SILVER
ADC Channels:	YES
No. of Terminals:	256
DMA Channels:	YES
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY
No. of I/O Lines:	199
Address Bus Width:	0
Screening Level:	AEC-Q100
Technology:	CMOS
JESD-30 Code:	S-PBGA-B256
Maximum Clock Frequency:	40 MHz
Package Shape:	SQUARE
ROM Words:	3145728
Terminal Form:	BALL
Maximum Operating Temperature:	125 Cel
Package Code:	BGA
Width:	17 mm
Moisture Sensitivity Level (MSL):	3
Speed:	120 rpm
Peripheral IC Type:	MICROCONTROLLER, RISC
Maximum Supply Voltage:	3.6 V
RAM Bytes:	262144
External Data Bus Width:	0
Bit Size:	32
JESD-609 Code:	e2
Minimum Operating Temperature:	-40 Cel
Qualification:	Not Qualified
Package Equivalence Code:	BGA256,16X16,40
Length:	17 mm
PWM Channels:	YES
Peak Reflow Temperature (C):	260
ROM Programmability:	FLASH
Terminal Pitch:	1 mm
Temperature Grade:	AUTOMOTIVE
Power Supplies (V):	3.3/5
CPU Family:	E200Z4

Pricing (USD)

Qty.	Unit Price	Ext. Price
2,860	-	-

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RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;

NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .6 A;