NXP Semiconductors - SPC5673FF3MVV2R

SPC5673FF3MVV2R by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number SPC5673FF3MVV2R
Description MICROCONTROLLER, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 516; Package Code: BGA; Package Shape: SQUARE;
In Stock2,704
NAME DESCRIPTION
Minimum Supply Voltage: 1.14 V
Package Body Material: PLASTIC
Nominal Supply Voltage: 1.2 V
Maximum Time At Peak Reflow Temperature (s): 30
Sub-Category: Microcontrollers
Surface Mount: YES
Terminal Finish: NICKEL GOLD
ADC Channels: YES
No. of Terminals: 516
DMA Channels: YES
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
Address Bus Width: 0
Screening Level: AEC-Q100
JESD-30 Code: S-PBGA-B516
Maximum Clock Frequency: 40 MHz
Package Shape: SQUARE
ROM Words: 3145728
Terminal Form: BALL
Maximum Operating Temperature: 125 Cel
Package Code: BGA
Width: 27 mm
Moisture Sensitivity Level (MSL): 3
Speed: 200 rpm
Peripheral IC Type: MICROCONTROLLER, RISC
Maximum Supply Voltage: 1.32 V
RAM Bytes: 196608
External Data Bus Width: 0
Bit Size: 32
JESD-609 Code: e4
Minimum Operating Temperature: -40 Cel
Qualification: Not Qualified
Package Equivalence Code: BGA516,26X26,40
Length: 27 mm
PWM Channels: YES
Peak Reflow Temperature (C): 245
ROM Programmability: FLASH
Terminal Pitch: 1 mm
Temperature Grade: AUTOMOTIVE
Power Supplies (V): 1.2,3.3,5
CPU Family: E200
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Pricing (USD)

Qty. Unit Price Ext. Price
2,704 $57.200 $154,668.800

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