SPC5673KFF0MMS1 by NXP Semiconductors | Peripheral ICs

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Manufacturer	NXP Semiconductors
Manufacturer's Part Number	SPC5673KFF0MMS1
Description	Microcontrollers; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 257; Package Code: FBGA; Package Shape: SQUARE;
In Stock	3,211

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Maximum Time At Peak Reflow Temperature (s):	40
Sub-Category:	Microcontrollers
Surface Mount:	YES
Maximum Supply Current:	900 mA
No. of Terminals:	257
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY, FINE PITCH
Screening Level:	AEC-Q100
Technology:	CMOS
JESD-30 Code:	S-PBGA-B257
Package Shape:	SQUARE
ROM Words:	1048576
Terminal Form:	BALL
Maximum Operating Temperature:	125 Cel
Package Code:	FBGA
Moisture Sensitivity Level (MSL):	3
Speed:	150 rpm
RAM Bytes:	262144
Bit Size:	32
Minimum Operating Temperature:	-40 Cel
Qualification:	Not Qualified
Package Equivalence Code:	BGA257,17X17,32
Peak Reflow Temperature (C):	260
ROM Programmability:	FLASH
Terminal Pitch:	.8 mm
Temperature Grade:	AUTOMOTIVE
Power Supplies (V):	1.2,3.3,5
CPU Family:	E200

Pricing (USD)

Qty.	Unit Price	Ext. Price
3,211	-	-

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