NXP Semiconductors - SPC5675KFF0VMS2R

SPC5675KFF0VMS2R by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number SPC5675KFF0VMS2R
Description MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 473; Package Code: FBGA; Package Shape: SQUARE;
In Stock136
NAME DESCRIPTION
Minimum Supply Voltage: 3 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 3.3 V
Maximum Time At Peak Reflow Temperature (s): 40
Sub-Category: Microcontrollers
Surface Mount: YES
Maximum Supply Current: 900 mA
Terminal Finish: TIN SILVER
ADC Channels: YES
No. of Terminals: 473
DMA Channels: YES
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, FINE PITCH
Screening Level: AEC-Q100
Technology: CMOS
JESD-30 Code: S-PBGA-B473
Maximum Clock Frequency: 40 MHz
Package Shape: SQUARE
ROM Words: 2097152
Terminal Form: BALL
Maximum Operating Temperature: 105 Cel
Package Code: FBGA
Width: 19 mm
Moisture Sensitivity Level (MSL): 3
Speed: 180 rpm
Peripheral IC Type: MICROCONTROLLER, RISC
Maximum Supply Voltage: 5.5 V
RAM Bytes: 524288
External Data Bus Width: 0
Bit Size: 32
JESD-609 Code: e2
Minimum Operating Temperature: -40 Cel
Qualification: Not Qualified
Package Equivalence Code: BGA473,23X23,32
Length: 19 mm
PWM Channels: YES
Peak Reflow Temperature (C): 260
ROM Programmability: FLASH
Terminal Pitch: .8 mm
Temperature Grade: INDUSTRIAL
Power Supplies (V): 1.2,3.3,5
CPU Family: E200
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