NXP Semiconductors - SPC5676RDK3MVU1R

SPC5676RDK3MVU1R by NXP Semiconductors

Image shown is a representation only.

Manufacturer NXP Semiconductors
Manufacturer's Part Number SPC5676RDK3MVU1R
Description MICROCONTROLLER, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 416; Package Code: BGA; Package Shape: SQUARE;
In Stock778
NAME DESCRIPTION
Minimum Supply Voltage: 1.14 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 1.2 V
Maximum Time At Peak Reflow Temperature (s): 40
Sub-Category: Microcontrollers
Surface Mount: YES
Terminal Finish: TIN SILVER
ADC Channels: YES
No. of Terminals: 416
DMA Channels: YES
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
No. of I/O Lines: 182
Address Bus Width: 32
Screening Level: AEC-Q100
JESD-30 Code: S-PBGA-B416
Maximum Clock Frequency: 40 MHz
Package Shape: SQUARE
ROM Words: 6291456
Terminal Form: BALL
Maximum Operating Temperature: 125 Cel
Package Code: BGA
Width: 27 mm
Moisture Sensitivity Level (MSL): 3
Speed: 180 rpm
Peripheral IC Type: MICROCONTROLLER, RISC
Maximum Supply Voltage: 1.32 V
RAM Bytes: 393216
External Data Bus Width: 32
Bit Size: 32
JESD-609 Code: e2
Minimum Operating Temperature: -40 Cel
Qualification: Not Qualified
Package Equivalence Code: BGA416,26X26,40
Length: 27 mm
PWM Channels: YES
Peak Reflow Temperature (C): 260
ROM Programmability: FLASH
Terminal Pitch: 1 mm
Temperature Grade: AUTOMOTIVE
Power Supplies (V): 1.2,3.3,5
CPU Family: E200
Plant 5!
Your quote plants 5 trees.

Pricing (USD)

Qty. Unit Price Ext. Price
778 - -

Popular Products

Category Top Products