NXP Semiconductors - SPC5743PGK1MMM9

SPC5743PGK1MMM9 by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number SPC5743PGK1MMM9
Description MICROCONTROLLER, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 257; Package Code: FBGA; Package Shape: SQUARE;
Datasheet SPC5743PGK1MMM9 Datasheet
In Stock1,344
NAME DESCRIPTION
Minimum Supply Voltage: 3.15 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 3.3 V
Sub-Category: Microcontrollers
Surface Mount: YES
ADC Channels: YES
No. of Terminals: 257
DMA Channels: YES
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, FINE PITCH
Address Bus Width: 32
Technology: CMOS
JESD-30 Code: S-PBGA-B257
Maximum Clock Frequency: 40 MHz
Package Shape: SQUARE
ROM Words: 2097152
Terminal Form: BALL
Maximum Operating Temperature: 125 Cel
Package Code: FBGA
Width: 14 mm
Speed: 200 rpm
Peripheral IC Type: MICROCONTROLLER, RISC
Maximum Supply Voltage: 3.6 V
RAM Bytes: 262144
External Data Bus Width: 64
Bit Size: 32
Minimum Operating Temperature: -40 Cel
Qualification: Not Qualified
Package Equivalence Code: BGA257,17X17,32
Length: 14 mm
PWM Channels: YES
ROM Programmability: FLASH
Terminal Pitch: .8 mm
Temperature Grade: AUTOMOTIVE
Power Supplies (V): 1.25,3.3
CPU Family: E200Z4
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